The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.
IPHONE 6S PLUS BOARD VIEW IN AUDIO IC SERIES
The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC and was introduced on September 9, 2009, at the launch of the third-generation iPod touch.Ī series Evolution of Apple "A" series It was manufactured by Samsung on a 65 nm process. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It was manufactured by Samsung on a 65 nm process. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. The APL0278 (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod touch. The iPhone 3G and the first-generation iPod touch also use it. It was manufactured by Samsung on a 90 nm process. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. The APL0098 (also 8900B or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. They combine in one package a single ARM-based processing core ( CPU), a graphics processing unit ( GPU), and other electronics necessary for mobile computing.
IPHONE 6S PLUS BOARD VIEW IN AUDIO IC UPDATE
We will update this post as more information comes to light.Apple first used SoCs in early versions of the iPhone and iPod touch. More about the cause of this problem will arise as techs continue to look into this issue. You might spend a bit to get it fixed, but you can make that money back when you sell it as a pre-owned device. Even if you wind up buying a device with an audio IC issue, you should bring it in to get the device fixed. Otherwise, if the customer insists on having their current phone repaired, and if your shop doesn’t have the equipment necessary, you can search for a specialist in your area. If they’re not willing to wait, offer them a pre-owned device, and tell them you’ll transfer their old data for free. Talk to the customer about the problem, and about how long it will take to ship the device to a specialist for repair. Shops that sell devices can take this as an opportunity to upsell. If you run into a device that’s suffering from an audio IC issue, there are a few ways of dealing with the problem. If the phone boots properly the customer could still have an issue with the audio IC as sometimes it presents itself with intermittent sound issues through the speakers, one or more of the microphones not working or other audio issues. Then once they are aware of the risk reboot the phone while the customer is still there so if it doesn't boot up properly they know it isn't your fault and the result of any repair you performed.
Our advice to every repair store is to be sure you notify the customer about this growing problem prior to any repair or before turning off the customers phone. This is because one of the data lines that is affected by the problem is needed during the boot sequence and if the data line signal isn't present the phone will reboot or get stuck on the Apple logo. The big issue that repair stores can find is if the customer brings in an iPhone 7 for a screen replacement or other repair they may not even know they have this problem until the phone is powered off and back on again.
Most shops don’t have the equipment needed to perform this type of repair.ĭevicePro Solutions offers this advice to any shop that has a device that might be suffering from an audio IC issue: The audio IC has to be removed, the board traces need to be reinforced or rebuilt, and the audio IC has to be reinstalled. Whatever the reason for why this joint comes undone, it’s not an easy fix to reattach it. Since there is a space next to this “fault line” where the SIM tray slides in, the integrity of the frame may also be compromised, which means the board may be more easily exposed to external damage. This stress point runs parallel to the top edge of the SIM tray holder, which means that the board may be more likely to bend along the line illustrated below. A possible reason may be the stress point under one edge of the audio IC, which also happens to be where the solder joints in question are located. This joint helps to connect the chip to the board, but it seems that the board level traces are cracking. While these issues are still under investigation, it seems that these problems are related to a failed solder joint or board trace under the audio IC. These issues can occur even if there aren’t signs of external damage on a device. These problems include delayed touch or no touch, a wide variety of audio failures, and boot looping. Techs across the industry have been reporting multiple issues with iPhone 7 and 7+ devices.